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M
Features
* * * * * * * * *
TC1240/TC1240A
General Description
The TC1240/TC1240A is a doubling CMOS charge pump voltage converter in a small 6-Pin SOT-23A package. The TC1240 doubles an input voltage that can range from +2.5V to +4.0V, while the TC1240A doubles an input voltage that can range from +2.5V to +5.5V. Conversion efficiency is typically >99%. Internal oscillator frequency is 160 kHz for both devices. The TC1240 and TC1240A have an active-high shutdown that limits the current consumption of the devices to less than 1 A. External component requirement is only two capacitors for standard voltage doubler applications. All other circuitry (including control, oscillator and power MOSFETs) are integrated on-chip. Typical supply current is 180 A for the TC1240 and 550 A for the TC1240A. Both devices are available in a 6-Pin SOT23A surface mount package.
Positive Doubling Charge Pumps with Shutdown in a SOT-23 Package
Charge Pumps in 6-Pin SOT-23A Package >99% Typical Voltage Conversion Efficiency Voltage Doubling Input Voltage Range, TC1240: +2.5V to +4.0V, TC1240A: +2.5V to +5.5V Low Output Resistance, TC1240: 17 (Typical) TC1240A: 12 (Typical) Only Two External Capacitors Required Low Supply Current, TC1240: 180 A (Typical) TC1240A: 550 A (Typical) Power-Saving Shutdown Mode (1 A Maximum) Shutdown Input Fully Compatible with 1.8V Logic Systems
Applications
* * * * * Cellular Phones Pagers PDAs, Portable Data Loggers Battery Powered Devices Handheld Instruments
Typical Application Circuit
Positive Voltage Doubler
+ C+ CVIN INPUT
Package Type
6-Pin SOT-23A
C+ 6 VOUT SHDN 5 4
C1
TC1240 TC1240A
SHDN OFF ON
VOUT GND + C2
2 x INPUT
TC1240ECH TC1240AECH
1 VIN 2 GND 3 C-
NOTE: 6-Pin SOT-23A is equivalent to the EIAJ (SC-74A)
2003 Microchip Technology Inc.
DS21516C-page 1
TC1240/TC1240A
1.0 ELECTRICAL CHARACTERISTICS
Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability.
Absolute Maximum Ratings
Input Voltage (VIN to GND) TC1240 ............................................. +4.5V, -0.3V TC1240A ........................................... +5.8V, -0.3V Output Voltage (VOUT to GND) TC1240 ....................................... +9.0V, VIN -0.3V TC1240A ................................... +11.6V, VIN -0.3V Current at VOUT Pin............................................50 mA Short-Circuit Duration: VOUT to GND .............Indefinite Thermal Resistance .......................................210C/W Power Dissipation (TA = +25C)........................600 mW Operating Temperature Range............. -40C to +85C Storage Temperature (Unbiased) ....... -65C to +150C
TC1240 ELECTRICAL SPECIFICATIONS
Electrical Specifications: Unless otherwise noted, typical values apply at TA = +25C. Minimum and maximum values apply for TA = -40 to +85C, and VIN = +2.8V, C1 = C2 = 3.3 F, SHDN = GND. Parameters Supply Current Shutdown Supply Current Minimum Supply Voltage Maximum Supply Voltage Oscillator Frequency Switching Frequency (Note 1) Shutdown Input Logic High Shutdown Input Logic Low Power Efficiency Voltage Conversion Efficiency Output Resistance (Note 2) Note 1: 2: Sym IDD ISHDN VMIN VMAX FOSC FSW VIH VIL PEFF VEFF ROUT Min -- -- 2.5 -- -- 40 1.4 -- 86 97.5 -- -- Typ 180 0.1 -- -- 160 80 -- -- 93 99.96 17 -- Max 300 1.0 -- 4.0 -- 125 -- 0.4 -- -- -- 30 Units A A V V kHz kHz V V % % RLOAD = SHDN = VIN RLOAD = 1.0 k RLOAD = 1.0 k TA = -40C to +85C TA = -40C to +85C VIN = VMIN to VMAX VIN = VMIN to VMAX RLOAD = 1.0 k RLOAD = RLOAD = 1.0 k TA = -40C to +85C Conditions
Switching frequency is one-half internal oscillator frequency. Capacitor contribution is approximately 26% of the output impedance [ESR = 1 / switching frequency x capacitance].
DS21516C-page 2
2003 Microchip Technology Inc.
TC1240/TC1240A
TC1240A ELECTRICAL SPECIFICATIONS
Electrical Specifications: Unless otherwise noted, typical values apply at TA = +25C. Minimum and maximum values apply for TA = -40 to +85C, and VIN = +5.0V, C1 = C 2 = 3.3 F, SHDN = GND. Parameters Supply Current Shutdown Supply Current Minimum Supply Voltage Maximum Supply Voltage Output Current Sum of the R DS(ON) of the internal MOSFET Switches Oscillator Frequency Switching Frequency (Note 1) Shutdown Input Logic High Shutdown Input Logic Low Power Efficiency Voltage Conversion Efficiency Output Resistance (Note 2) Note 1: 2: Sym IDD ISHDN VMIN VMAX ILOAD RSW FOSC FSW VIH VIL PEFF VEFF ROUT Min -- -- 2.5 -- 20 -- -- 40 1.4 -- 86 99 -- -- Typ 550 0.01 -- -- -- 4 160 80 -- -- 94 99.96 12 -- Max 900 1.0 -- 5.5 -- 8 -- 125 -- 0.4 -- -- -- 25 Units A A V V mA kHz kHz V V % % ILOAD = 20 mA TA = -40C to +85C TA = -40C to +85C VIN = VMIN to VMAX VIN = VMIN to VMAX ILOAD = 5 mA RLOAD = ILOAD = 20 A TA = -40C to +85C RLOAD = SHDN = VIN Conditions
Switching frequency is one-half internal oscillator frequency. Capacitor contribution is approximately 26% of the output impedance [ESR = 1 / switching frequency x capacitance].
2003 Microchip Technology Inc.
DS21516C-page 3
TC1240/TC1240A
2.0
Note:
TYPICAL PERFORMANCE CURVES
The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, typical values apply at TA = +25C.
700 SUPPLY CURRENT (A)
SUPPLY CURRENT (A) 450 400 350 300 250 200 150 100 50 VIN = 2.8V VIN = 4.0V
600 500 400 300 200 100 0 2.00 3.00 4.00 SUPPLY VOLTAGE (V) 5.00 6.00
0 -50
-25
0
25 50 75 TEMPERATURE (C)
100
125
FIGURE 2-1: Supply Current vs. Supply Voltage (No Load).
OUTPUT SOURCE RESISTANCE () 20
FIGURE 2-4: Supply Current vs. Temperature (No Load).
OUTPUT SOURCE RESISTANCE () 25 20 VIN = 2.8V 15 VIN = 4.0V 10 5 0 -50
15
10
5
0 2.00 3.00 4.00 SUPPLY VOLTAGE (V) 5.00 6.00
-25
0
25 50 75 TEMPERATURE (C)
100
125
FIGURE 2-2: Output Source Resistance vs. Supply Voltage (with RLOAD = 1 k)
1 0.9 0.8 VOLT DROP (V) 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0 5 10 15 20 25 30 35 LOAD CURRENT (mA) 40 45 50 VIN = 2.8V VIN = 4.0V
FIGURE 2-5: Output Source Resistance vs. Temperature (with RLOAD = 1 k).
100% 90% POWER EFFICIENCY (%) 80% 70% 60% 50% 40% 30% 20% 10% 0% 0 5 10 15 20 25 30 35 LOAD CURRENT (mA) 40 45 50 VIN = 2.5V VIN = 3.5V VIN = 4.5V
FIGURE 2-3: Load Current.
Output Voltage Drop vs.
FIGURE 2-6: Current.
Power Efficiency vs. Load
DS21516C-page 4
2003 Microchip Technology Inc.
TC1240/TC1240A
Note: Unless otherwise indicated, typical values apply at TA = +25C.
100 SWITCHING FREQUENCY (kHz) 80 VIN = 2.8V 60 40 20 0 -50 VIN = 4.0V
-25
0
25 50 75 TEMPERATURE (C)
100
125
FIGURE 2-7: Temperature.
Switching Frequency vs.
2003 Microchip Technology Inc.
DS21516C-page 5
TC1240/TC1240A
3.0 PIN DESCRIPTION
The description of the pins are listed in Table 3-1.
TABLE 3-1:
Pin No. 1 2 3 4 5 6
PIN FUNCTION TABLE
Symbol VIN GND CSHDN VOUT C+ Power supply input Ground Commutation capacitor negative terminal Shutdown input (active high) Doubled output voltage Commutation capacitor positive terminal Description
DS21516C-page 6
2003 Microchip Technology Inc.
TC1240/TC1240A
4.0 DETAILED DESCRIPTION 5.0
5.1
TYPICAL APPLICATIONS
Output Voltage Considerations
The TC1240/TC1240A charge pump converter doubles the voltage applied to the VIN pin. Conversion consists of a two-phase operation (Figure 4-1). During the first phase, switches S2 and S4 are open and S1 and S3 are closed. During this time, C 1 charges to the voltage on V IN and load current is supplied from C2. During the second phase, S2 and S 4 are closed, while S1 and S3 are open. During this second phase, C1 is level-shifted upward by VIN volts. This connects C 1 to the reservoir capacitor C2, allowing energy to be delivered to the output as needed. The actual voltage is slightly lower than 2 x V IN since the four switches (S 1-S4) have an on-resistance and the load drains charge from reservoir capacitor C2.
The TC1240/TC1240A performs voltage doubling but does not provide regulation. The output voltage will droop in a linear manner with respect to load current. The value of this equivalent output resistance is approximately 12 nominal at +25C and VIN = +5.0V for the TC1240A and 17 nominal at +25C and VIN = +2.8V for the TC1240. VOUT is approximately +10.0V at light loads for the TC1240A and +5.6V for the TC1240, and droops according to the equation below:
EQUATION
V DROOP = I OUT x R OUT V OUT = 2 x V IN - V DROOP
VIN
S1
C1
S2
TC1240/TC1240A
5.2
Charge Pump Efficiency
The overall power efficiency of the charge pump is affected by four factors: VOUT = 2 x VIN C2 1. Losses from power consumed by the internal oscillator, switch drive, etc. (which vary with input voltage, temperature and oscillator frequency). I2R losses due to the on-resistance of the MOSFET switches on-board the charge pump. Charge pump capacitor losses due to effective series resistance (ESR). Losses that occur during charge transfer (from commutation capacitor to the output capacitor) when a voltage difference between the two capacitors exist.
S3
S4 2. VIN 3. 4.
OSC
FIGURE 4-1: Ideal Switched Capacitor Charge Pump Doubler.
Most of the conversion losses are due to factors (2) and (3) above. These losses are given by Equation 5-1.
EQUATION 5-1:
a) P LOSS(2,3) = I OU T x R O UT 1b) R O UT = --------------------- + 8R SWITCH + 4ESR C1 + ESR C2 F SW ( C 1 )
2
2003 Microchip Technology Inc.
DS21516C-page 7
TC1240/TC1240A
The switching frequency in Equation 5-1b is defined as one-half the oscillator frequency (i.e., FSW = FOSC/2). The 1/(FSW)(C1) term in Equation 5-1b is the effective output resistance of an ideal switched capacitor circuit (Figure 5-1 and Figure 5-2). The output voltage ripple is given by Equation 5-2.
5.3
Capacitor Selection
In order to maintain the lowest output resistance and output ripple voltage, it is recommended that low ESR capacitors be used. Additionally, larger values of C 1 will lower the output resistance and larger values of C2 will reduce output ripple (see Equation 5-1b). Table 5-1 shows various values of C1 and the corresponding output resistance values @ +25C. It assumes a 0.1 ESRC1 and 0.9 RSW. Table 5-2 shows the output voltage ripple for various values of C 2. The VRIPPLE values assume 5mA output load current and 0.1 ESRC2.
EQUATION 5-2:
I OUT V RIPPLE = -------------------------------- + 2 ( I OUT ) ( ESR C2 ) 2 ( F SW ) ( C 2 ) f V+ C1 C2 RL VOUT
TABLE 5-1:
C1 (F) 0.47
OUTPUT RESISTANCE VS. C1 (ESR = 0.1)
TC1240 R OUT() 47 28.5 19.5 17 15.5 13.6 12.5 12.2 TC1240A ROUT() 35 20.5 14 12 10.5 9.3 8.3 8.1
FIGURE 5-1: Model.
REQUIV V+
Ideal Switched Capacitor
1 2.2 3.3 4.7
VOUT C2 RL
10 47 100
REQUIV = 1 FSW x C 1
TABLE 5-2: FIGURE 5-2: Resistance. Equivalent Output
C1 (F) 0.47 1 2.2 3.3 4.7 10 47 100
OUTPUT VOLTAGE RIPPLE VS. C2 (ESR = 0.1) IOUT 5 mA
TC1240/TC1240A VRIPPLE (mV) 142 67 30 20 14 6.7 2.5 1.6
DS21516C-page 8
2003 Microchip Technology Inc.
TC1240/TC1240A
5.4 Input Supply Bypassing 5.6 Voltage Doubler
The VIN input should be capacitively bypassed to reduce AC impedance and minimize noise effects due to the switching internal to the device. The recommended capacitor should be a large value (at least equal to C 1) connected from the input to GND. The most common application for charge pump devices is the doubler (Figure 5-3). This application uses two external capacitors - C1 and C 2 (plus a power supply bypass capacitor, if necessary). The output is equal to 2 x VIN minus any voltage drops due to loading. Refer to Table 5-1 and Table 5-2 for capacitor selection.
5.5
Shutdown Input
The TC1240 and TC1240A are disabled when SHDN is high, and enabled when SHDN is low. This input cannot be allowed to float. VIN
C3
+
VOUT 5 OUT C+ 6 C1 +
+
TC1240 TC1240A 1V
IN
C2 RL
2 3 CGND 4 SHDN
Device TC1240 TC1240A
C1 3.3 F
C2 3.3 F
C3 3.3 F
FIGURE 5-3:
Test Circuit.
2003 Microchip Technology Inc.
DS21516C-page 9
TC1240/TC1240A
5.7 Cascading Devices 5.8 Paralleling Devices
Two or more TC1240/TC1240As can be cascaded to increase output voltage (Figure 5-4). If the output is lightly loaded, it will be close to ((n + 1) x VIN), but will droop at least by ROUT of the first device multiplied by the IQ of the second. It can be seen that the output resistance rises rapidly for multiple cascaded devices. For the case of the two-stage `tripler', output resistance can be approximated as ROUT = 2 x ROUT1 + ROUT2, where ROUT1 is the output resistance of the first stage and ROUT2 is the output resistance of the second stage. To reduce the value of ROUT, multiple TC1240/ TC1240As can be connected in parallel (Figure 5-5). The output resistance will be reduced by a factor of N, where N is the number of TC1240/TC1240As. Each device will require its own pump capacitor (C1x), but all devices may share one reservoir capacitor (C2). However, to preserve ripple performance, the value of C2 should be scaled according to the number of paralled TC1240/TC1240As, respectively.
5.9
Layout Considerations
As with any switching power supply circuit good layout practice is recommended. Mount components as close together as possible to minimize stray inductance and capacitance. Also use a large ground plane to minimize noise leakage into other circuitry. VIN 6 C+ + VIN 1 6 C+ VIN 1
C1A
TC1240 TC1240A 2 GND 3 "1" OUT 5 C4 SHDN +
+ C1B
TC1240 TC1240A GND VOUT C2B
2
C2A
5 3 C"n" OUT 4 SHDN + VOUT = (n + 1)VIN
FIGURE 5-4:
Cascading Multiple Devices To Increase Output Voltage.
ROUT OF SINGLE DEVICE NUMBER OF DEVICES ... 1 3 TC1240 TC1240A "1" SHDN C1B 5 2 + 6 "n" 4 SHDN ... VOUT = 2 x VIN 5 VOUT TC1240 TC1240A VIN
ROUT = VIN 1 3 C1A 2 + 6 4
+
C2
Shutdown Control
FIGURE 5-5:
Paralleling Multiple Devices To Reduce Output Resistance.
DS21516C-page 10
2003 Microchip Technology Inc.
TC1240/TC1240A
6.0
6.1
PACKAGING INFORMATION
Package Marking Information
6-Pin SOT-23A
6 5 4
1
2
3
4
1
2
3
1
&
2
= part number code + temperature range (two-digit code)
Device TC1240 TC1240A
ex: 1240AECH = E
N
Code DN EN
3
represents year and 2-month code represents production lot ID code
4
2003 Microchip Technology Inc.
DS21516C-page 11
TC1240/TC1240A
6-Lead Plastic Small Outline Transistor (CH) (SOT-23)
E E1
B
p1
D
n
1
c A L A1 A2
Number of Pins 6 Pitch .038 p1 Outside lead pitch (basic) .075 Overall Height A .035 .046 .057 Molded Package Thickness .035 .043 .051 A2 Standoff .000 .003 .006 A1 Overall Width E .102 .110 .118 Molded Package Width .059 .064 .069 E1 Overall Length D .110 .116 .122 Foot Length L .014 .018 .022 Foot Angle 0 5 10 c Lead Thickness .004 .006 .008 Lead Width B .014 .017 .020 Mold Draft Angle Top 0 5 10 Mold Draft Angle Bottom 0 5 10 *Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side. JEITA (formerly EIAJ) equivalent: SC-74A
Drawing No. C04-120
Units Dimension Limits n p
MIN
INCHES* NOM
MAX
MIN
MILLIMETERS NOM 6 0.95 1.90 0.90 1.18 0.90 1.10 0.00 0.08 2.60 2.80 1.50 1.63 2.80 2.95 0.35 0.45 0 5 0.09 0.15 0.35 0.43 0 5 0 5
MAX
1.45 1.30 0.15 3.00 1.75 3.10 0.55 10 0.20 0.50 10 10
DS21516C-page 12
2003 Microchip Technology Inc.
TC1240/TC1240A
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device X Temperature Range /XX Package Examples:
a) b) Device TC1240: TC1240A I Positive Doubling Charge Pump with Shutdown Positive Doubling Charge Pump with Shutdown TC1240ECHTR: Tape and Reel, 6L SOT-23 (EIAJ) TC1240AECHTR: Tape and Reel, 6L SOT-23 (EIAJ)
Temperature Range Package
= -40C to +85C (Industrial) 6L SOT-23, Tape and Reel
CHTR: =
Sales and Support
Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
2003 Microchip Technology Inc.
DS21516C-page 13
TC1240/TC1240A
NOTES:
DS21516C-page 14
2003 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices: * * * Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable."
* *
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip's products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights.
Trademarks The Microchip name and logo, the Microchip logo, KEELOQ, MPLAB, PIC, PICmicro, PICSTART, PRO MATE and PowerSmart are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, microID, MXDEV, MXLAB, PICMASTER, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Accuron, Application Maestro, dsPIC, dsPICDEM, dsPICDEM.net, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, PICC, PICkit, PICDEM, PICDEM.net, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPIC, Select Mode, SmartSensor, SmartShunt, SmartTel and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2003, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved.
Printed on recycled paper. Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999 and Mountain View, California in March 2002. The Company's quality system processes and procedures are QS-9000 compliant for its PICmicro(R) 8-bit MCUs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001 certified.
2003 Microchip Technology Inc.
DS21516C-page 15
M
WORLDWIDE SALES AND SERVICE
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03/25/03
DS21516C-page 16
2003 Microchip Technology Inc.

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Price & Availability of TC1240AICHTR

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